In this research, aiming at efficient cooling of the locally concentrated heating part of the electronic element, a new concentric circular microchannel plate that can efficiently cool the CPU is designed in consideration of the heat generation characteristics of the CPU. Then, we conducted an experiment on heat transfer when water was used as the refrigerant for this new microchannel plate, and grasped the basic heat transfer characteristics. Furthermore, by comparing the results with the straight microchannel plate having a simple structure, the heat transfer promotion of the concentric microchannel plate was examined. By using a concentric microchannel plate, the temperature at the center of the heater can be maintained at about 25℃, and even when compared with a straight microchannel plate, the temperature rise can be suppressed by about 8 to 23℃. The heat transfer coefficient of the concentric circular microchannel plate is 6 to 8 kW/m^2 K, which is almost constant, and about four times higher than the heat transfer coefficient of the straight microchannel plate at the same heat quantity and the same flow rate. In addition, the research results were compared with the previously proposed experimental correlation equation for single phase forced convection laminar heat transfer of straight microchannnels.